When they leave the foundry in Taiwan, they aren't ready to be just used. I'm not sure if TSMC even cuts the dies out of the wafers, then they need to be packaged and binned (not necessarily in that order... Being packaged makes binning easier but it's a waste to package a junk chip). Packaging might happen in Malaysia, Singapore, or China (or elsewhere, I just know those countries have packaging facilities).

Packaging is when they put the chip(s) on the little PCB that has the pins or pads (for CPUs), though GPUs generally go on a board of some sort, though I can only guess how this one was packaged. Imagining Jensen Huang on an assembly line, licking the backs of GPUs and sticking them on missiles as they pass by and causually get dumped in a steel bin at the end of the conveyor, but that's probably not what's happening with them.